От: D&R SoC NewsAlert [SoC-NewsAlert@design-reuse.com]
Отправлено: 7 сентября 2004 г. 12:17
Кому: Michael Dolinsky
Тема: D&R SoC News Alert - September 7, 2004
DR SoC News Alert
Design And ReuseDesign And ReuseDesign And Reuse
EETimes Network
September 7, 2004    


Welcome to issue of September 7, 2004 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

SPONSORED BY: SYNOPSYS

FREE Seminars: Learn from the leading provider of standards-based IP about PCI Express, USB, SATA and AMBA on-chip bus. Join our IP experts at seminars throughout Europe to learn more about these standards and how DesignWare IP enables you to quickly add them to your chips. Click here to register now

OCP-IP 2.0 PSL Checker from HDL Design House
PCI Express Root and EP dual mode (dynamical switching), PCI Express Switch Port Core and PCI express Root Complex Port Core from Cascade Semiconductor
MPEG4 Encoder (CIF) from Global UniChip
Hi-Speed USB 2.0 On-The-Go PHY from Synopsys
HDTV Video Front End from ChipIdea Microelectronics
Wanted IPs :
  • USB 1.1 OTG Transceiver
  • Low leakage SRAM/Logic for UMC 0.18u std cmos process
  • Bluetooth headset solution
  • 'Symmetric' design technique facilitates power analysis
    Multi-Ports Eliminate Baseband Processing Bottlenecks
    Interview - Rajeev Madhavan, chairman and CEO of Magma Design: Intellectual Propriety (by Ed Sperling, Electronic News)
    ASIC design starts to halt decline, says iSuppli
    IP/SOC PRODUCTS
    TransEDA Announces PCI All-in-One Verification IP and VN-Control 3.0 for PCI Express, PCI-X and PCI Based Designs
    TriCN partners with PLDApplications for full PCI Express solution
    Genesys Logic Introduces PCI Express and GigaSata Serial ATA Products at Intel Develop Forum
    RF Engines launches SpectraChip, a digital replacement for analogue intermediate frequency (IF) filtering used in current spectrum analysers
    Faraday Technology Introduces Industry's Smallest PCI-Express Solution at UMC 0.13um
    Tensilica Announces Major IC Design Automation Breakthrough, The Automatic Generation of Optimized Programmable RTL Engines from Standard C Code
    Pioneering DSP core breaks more ground with new processing modules
    Intellectutal Property Support For New FPGA Familes Announced By Lattice Semiconductor And CAST Incorporated
    Dolphin's Read-Only Memory generator embeds the highest density on standard CMOS
    STRUCTURED ASIC
    LSI Logic Debuts Innovative SAS and SATA II Storage Adapters and Platform ASIC Methodology at Intel Developer Forum
    LSI Logic Offers Complete PCI Express Solution For Rapidchip Platform ASIC
    DEALS
    AMI Semiconductor Chooses ARM To Drive Automotive Electronics For Information, Performance And Safety In Cars
    Ambarella licenses the World's First Standard SD MMC 4.0 Host Controller IP core from Arasan Chip Systems
    BUSINESS
    Memec Insight Becomes New Distributor of Nordic Semiconductor ASA in Europe
    ASICS World Services, LTD, Joins Xilinx AllianceCORE and Common License Consortium Programs
    Coreworks and Prototyping-Japan agreement to promote and distribute digital audio and video IP coresCoreworks and Prototyping-Japan agreement to promote and distribute digital audio and video IP cores and evaluation boards in the Japanese market and
    Monolithic System Technology, Inc. Announces Grant of Stock Options
    Samsung Semiconductor Teams with Denali to Accelerate OneNAND Flash Adoption
    FINANCIAL RESULTS
    Altera pre-announces shortfall for Q3
    LEGAL
    Court Awards MOSAID Monetary Sanctions in Lawsuit Against Samsung
    PEOPLE
    Xilinx announces new DSP division, industry veteran Omid Tahernia named Vice President and General Manager
    EMBEDDED SYSTEMS
    EVE Unveils ZeBu-XL, the Electronics Industry's First High-End Prototyping Solution
    SIDSA announces the new "CARMeN-II" ARM emulation board for SoC Development &Validation
    Accelerated Technology's Nucleus EDGE Next Generation Development Environment Ushers In New Era of Eclipse Platform Use
    Intel will demo its first multi-core CPU at IDF
    Atmel Introduces a Complete Biometric System for Easy Integration Into Customer Applications
    FOUNDRIES
    SMIC looks to China's fabless firms, touts 90-nm
    FPGA/CPLD
    Xilinx executes on FPGA processor leadership strategy, forms new embedded processing division
    Pirelli Chooses Altera Stratix GX Devices for Radio-Over-Fiber 3G Network Solution
    Altera Introduces Stratix II Development Kits for High-Speed, DSP, and Embedded System Designs
    Altera's New MAX II Development Kit Simplifies Low-Cost CPLD Design

    SPONSORED BY: TEMENTO SYSTEMS

    Temento Systems, innovative provider of test, debug and verify solutions for FPGA and Hardware Platforms now offer two Edition of its DiaLite On-Chip Instrumentation tool. The new HDL Fault Finder IP included into the Power Edge Edition allows accurate monitoring and display of logic events contained into your HDL code. Designers have now the possibility to insert Watchpoints and Breakpoints on the instruments and into the code, and make it run concurrently to the instrumentation.

    Click here to know more about Temento






    IP/SOC 2004
    Grenoble, France
    December 8-9, 2004


    D&R Silicon IP / SoC Catalog :
    The world's largest directory of Silicon IP (Intellectual Property), SoC Configurable Design Platforms and SOPC Products from 200 vendors

    D&R Software IP Catalog :
    A catalog of Hardware dependent Software (HdS) ranging from embedded OS to Communication Stacks and Application Software

    D&R Verification IP Catalog :
    Speed up your verification of protocol-centric designs by finding the specific Verification IP you need (already more than 100 products listed !!!)



    Search for Silicon IP

    Search for Verification IP

    Search for Software IP

    Find an Expert

    Industry Articles

    Latest News

    Tool Demos

    Free IP Cores


    DESIGN AND REUSE S.A.

    Corporate Headquarters:
    12 rue Ampere
    BP 267
    38 016 Grenoble Cedex 1
    FRANCE
    Tel: +33 476 21 31 02
    Fax: +33 476 49 00 52

    US office:
    5600 Mowry School Road
    Suite 180
    Newark, CA 94560
    USA
    Tel: +1 510 656 1445
    Fax: +1 510 656 0995


    REGISTER:
    If this newsletter was forwarded to you by a colleague, you can have it sent directly to you at no cost. To register for D&R SoC News Alert, go to: http://www.us.design-reuse.com/users/signup.php

    UPDATE YOUR PROFILE / UNSUBSCRIBE :
    You are subscribed as dolinsky@gsu.by and you receive this Alert once a week in html format.

    * If you wish to unsubscribe, you can do it there

    * If you need to change the e-mail address at which you receive this newsletter, you can do it there

    * If you need to update your user profile for receiving this letter on another time basis or in another format, you can do it there

    The SoC News Alert can be delivered :
    - Twice a week, once a week or once a month
    - In html or text format

    COMMENTS / SUGGESTIONS / QUESTIONS:
    Anything about the contents of this alert can be directed to : support@design-reuse.com

    PASS IT ON. . .
    Feel free to forward this newsletter to your colleagues.